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  8. Lámina delgada de cobre, alta conductividad sin oxígeno (OFHC), 0,008 mm de grosor, 99,99 % (base metálica), Thermo Scientific Chemicals

Lámina delgada de cobre, alta conductividad sin oxígeno (OFHC), 0,008 mm de grosor, 99,99 % (base metálica), Thermo Scientific Chemicals

Código de producto. 15495005
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Cantidad:
25 x 25 mm
50 x 50 mm
100 x 100 mm

Descripción

This Thermo Scientific Chemicals brand product was originally part of the Alfa Aesar product portfolio. Some documentation and label information may refer to the legacy brand. The original Alfa Aesar product / item code or SKU reference has not changed as a part of the brand transition to Thermo Scientific Chemicals.

TRUSTED_SUSTAINABILITY

Identificadores de productos químicos

CAS 7440-50-8
Fórmula molecular Cu
Peso molecular (g/mol) 63.55
Número MDL MFCD00010965
Clave InChI RYGMFSIKBFXOCR-UHFFFAOYSA-N
Sinónimo cuprum, cobre, cuivre, blister, cathode, bronze, powder, anode, precipitates, kupfer
PubChem CID 23978
ChEBI CHEBI:30052
Nombre IUPAC copper
SMILES [Cu]

Especificaciones

Nombre del producto químico o material Copper Thinfoil
Nombre de nota Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003 in.) thick
Notas del porcentaje del ensayo (base metálica)
Cantidad 100 x 100 mm
Porcentaje de pureza 99.99%
Olor Odorless
Peso ≈0.04g/25x25mm
Formulario Lámina delgada, ≈ 0,04 g/25x25 mm

RUO – Research Use Only

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