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Lámina delgada de cobre, alta conductividad sin oxígeno (OFHC), 0,008 mm de grosor, 99,99 % (base metálica), Thermo Scientific Chemicals

Catalog Number 15495005
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Cantidad:
25 x 25 mm
50 x 50 mm
100 x 100 mm
7440-50-8
Cu
63.55
MFCD00010965
RYGMFSIKBFXOCR-UHFFFAOYSA-N
cuprum, cobre, cuivre, blister, cathode, bronze, powder, anode, precipitates, kupfer
23978
CHEBI:30052
copper
[Cu]
7440-50-8
Cu
63.55
MFCD00010965
RYGMFSIKBFXOCR-UHFFFAOYSA-N
cuprum, cobre, cuivre, blister, cathode, bronze, powder, anode, precipitates, kupfer
23978
CHEBI:30052
copper
[Cu]

This Thermo Scientific Chemicals brand product was originally part of the Alfa Aesar product portfolio. Some documentation and label information may refer to the legacy brand. The original Alfa Aesar product / item code or SKU reference has not changed as a part of the brand transition to Thermo Scientific Chemicals.

TRUSTED_SUSTAINABILITY
Nombre del producto químico o material Copper Thinfoil
Nombre de nota Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003 in.) thick
Notas del porcentaje del ensayo (base metálica)
Cantidad 100 x 100 mm
Porcentaje de pureza 99.99%
Olor Odorless
Peso ≈0.04g/25x25mm
Formulario Lámina delgada, ≈ 0,04 g/25x25 mm

RUO – Research Use Only

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