Copper (Cu)

Copper (Cu)
Copper has been mined for 5,000 years. It is a reddish metal that takes on a bright luster. Malleable and ductile, it is a good conductor of heat and electricity.
Copper can occur naturally in large ore deposits of sulfides, oxides, and carbonates. It is also found in cuprite, malachite, azurite, chalcopyrite, bornite, and other minerals.
Copper's largest use is in the electrical industry, and its alloys, brass and bronze, are used in coins and gun metals. Copper is also used as both an agricultural poison and an algaecide. Copper compounds are widely used in analytical chemistry testing.
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Resultados de la búsqueda filtrada

Lámina de cobre, 99,999 % (base metálica), Thermo Scientific Chemicals, Puratronic™
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Lámina de cobre, 99,999 % (base metálica), Thermo Scientific Chemicals, Puratronic™
CAS: 7440-50-8 Fórmula molecular: Cu Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Carga de cobre, 1-10 mm, 99,9 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Lámina de cobre, 99,99 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Alambre de cobre, 1,0 mm de diámetro, recocido, 99,9 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Polvo de cobre, malla - 325, 10 % malla + 325 máx., 99 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Alambre de cobre, 99,9985% (base metálica), Thermo Scientific Chemicals, Puratronic™
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Alambre de cobre, 2,0 mm de diámetro, Puratronic™, 99,999 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Lámina de cobre, 0,25 mm de grosor, Puratronic™, 99,9999 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Lámina de cobre, 0,254 mm de grosor, 99,9 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Lámina de cobre, 0,675 mm de grosor, recocido, 99,9 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Lámina de cobre, 0,5 mm de grosor, Puratronic™, 99,9999 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Polvo de cobre, malla -150, 99,5 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Lámina de cobre, 0,5 mm de grosor, Puratronic™, 99,998 % (base metálica), sin oxígeno, Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |
Lámina de cobre, 0,5 mm de grosor, Puratronic™, 99,9985 % (base metálica), Thermo Scientific Chemicals
CAS: 7440-50-8 Fórmula molecular: Cu Peso molecular (g/mol): 63.55 Número MDL: MFCD00010965 Clave InChI: RYGMFSIKBFXOCR-UHFFFAOYSA-N Sinónimo: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 Nombre IUPAC: cobre SMILES: [Cu]
Sinónimo | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
---|---|
Clave InChI | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID | 23978 |
Fórmula molecular | Cu |
CAS | 7440-50-8 |
ChEBI | CHEBI:30052 |
Peso molecular (g/mol) | 63.55 |
Número MDL | MFCD00010965 |
SMILES | [Cu] |
Nombre IUPAC | cobre |